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DataSheet.in
ECMF02-2AMX6
Common mode filter with ESD protection for USB 2.0 and MIPI D-PHY/MDDI interface
Features

Very large differential bandwidth > 6 GHz High common mode attenuation: - -34 dB at 900 MHz - -20 dB between 800 MHz and 2.2 GHz Very low PCB space consumption Thin package: 0.55 mm max Lead-free package High reduction of parasitic elements through integration
Micro QFN-6L: 1.7 mm x 1.5 mm

Applications

Mobile phones Notebook, laptop Portable devices PND
Figure 1.
Pin configuration (top view)
D+ ESD ESD
D+
Description
The ECMF02-2AMX6 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI or USB 2.0. The ECMF02-2AMX6 can protect and filter one differential lane.
DESD ESD D-
GND
NC
August 2010
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DataSheet.in
Characteristics
ECMF02-2AMX6
1
Table 1.
Symbol VPP Tj Top Tstg
Characteristics
Absolute maximum ratings (Tamb = 25 C)
Parameter Peak pulse voltage: IEC 61000-4-2, level 4 contact discharge Junction temperature Operating junction temperature range Storage temperature range Value 8 125 -30 to +85 - 55 to +150 Unit kV C C C
Figure 2.
Electrical characteristics (definitions)
Table 2.
Symbol VBR IRM RDC
Electrical characteristics (values, Tamb = 25 C)
Test conditions IR = 1 mA VRM = 1.5 V per line DC serial resistance 1.8 Min. 6 100 2.5 Typ. Max Unit V nA
Compliant with USB 2.0 high speed sync field test (150 mV diff).
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ECMF02-2AMX6
Characteristics
Figure 3.
0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -2.2 -2.4 -2.6 -2.8 -3
Sdd21 differential attenuation measurements (Z0 diff = 100 )
Sdd21
Figure 4.
0 -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36
Scc21 common mode attenuation measurements (Z0 com = 50 )
Scc21
F(Hz)
300k 1M 3M 10M 30M 100M 300M 1G 3G
F(Hz)
300k 1M 3M 10M 30M 100M 300M 1G 3G
Figure 5.
Sdd11, Sdd22 differential return loss Figure 6. measurements (Z0 diff = 100 )
0 - 10 - 20 - 30 - 40 - 50
Sdd41 / Sdd23 inter-lane differential cross-coupling measurements (Z0 diff = 100 )
0 -5 - 10 - 15 - 20
Sdd11, Sdd22
Sdd11 Sdd22
Sdd41 / Sdd23
- 60 - 25 - 30 - 35 - 40 300k 1M 3M 10M 30M 100M 300M 1G - 70 - 80 - 90
F(Hz)
3G
- 100 - 110 300k
F(Hz)
1M 3M 10M 30M 100M 300M 1G 3G
Figure 7.
0 0.2 0.4 0.6 0.8 -1 - 1.2 - 1.4 - 1.6 - 1.8 -2 - 2.2 - 2.4 - 2.6 - 2.8 -3 -
Sdd21 differential attenuation measurements (Z0 diff = 90 )
Sdd21
Figure 8.
0 -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36
Scc21 common mode attenuation measurements (Z0 com = 45 )
Scc21
Scc21
F(Hz)
300k 1M 3M 10M 30M 100M 300M 1G 3G
F(Hz)
300k 1M 3M 10M 30M 100M 300M 1G 3G
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Characteristics Figure 9. ESD measurement test setup
ECMF02-2AMX6
ESD contact zap 8kV on pin 1
D+ ESD ESD D+
2*20dB attenuator
Oscilloscope 50 input
DESD ESD
D-
GND
NC
2*20dB attenuator
ECMF02 - 2AMX6
Figure 10. ESD response to IEC 61000-4-2 (+8 kV contact discharge) - see Figure 9 for test setup
20 ns/Div
Figure 11. ESD response to IEC 61000-4-2 (-8 kV contact discharge) - see Figure 9 for test setup
20 V/Div
82.3 V PIN 6
20 V/Div
C2 PIN 6
20 ns/Div
C2 -71.1 V 112 V C3 -115 V PIN 5 PIN 5 C3
50 V/Div
20 ns/Div
50 V/Div
20 ns/Div
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ECMF02-2AMX6 Figure 12. MIPI D-PHY low power mode test setup
Characteristics
Generator Agilent 81110 Pattern mode, F=10MHz, modulation RZ, 50 output
Oscilloscope Lecroy 7300A, 1M input
CMF
Figure 13. Low power pulse response - see Figure 12 for test setup
500 mV/div Pulse: 50 ns, tr = tf = 5 ns
200 ns/div 500 mV/div
200 ns/div
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Characteristics Figure 14. USB 2.0 HSync measurement test setup
ECMF02-2AMX6
Net PC Samsung NP-N510 Left USB output
Oscilloscope Lecroy 7300A
CMF USB output
USB key
Figure 15. USB 2.0 HSync measurement result
200 mV/Div
200 mV/Div
5 ns/Div
5 ns/Div
Figure 16. USB 2.0 eye diagram, mask T1
0.2V/div
342.2ps/div
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ECMF02-2AMX6
Application schematics
2
Application schematics
Figure 17. MIPI D-PHY
Camera
CSI Transmitter Data N+ Data N GND
ECMF02-2AMX6
D+ D+
Application Baseband
CSI Receiver Data N+ Data N GND
D-
D-
GND
NC
Data 1+ Data 1GND
D1+ D1GND1 NC
D1+ D1NC GND0 D0+ D0-
Data 1+ Data 1GND
Clock + Clock GND
D0+ D0-
Clock + Clock GND
ECMF04-4AMX12
CCI Slave
SCL SDA
IN 1 4 OUT
CCI Master
SCL SDA
GND 2 3 5 GND 6
IN
OUT
EMIF02-1003M6
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Application schematics Figure 18. USB 2.0
ECMF02-2AMX6
GND
USB Transceiver
ESDALC6V1-1U2 ID D+ DV BUS
D+
ESD ESD
D+
DESD ESD
D-
GND
NC
Micro-USB LFTVS10-1F3
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ECMF02-2AMX6
Ordering information scheme
3
Ordering information scheme
Figure 19. Ordering information scheme
ECMF 02 - 2 A xxx
Function ESD common mode filter Number of Lines 02 = 2 lines Number of ESD protected lines 2 = 2 ESD protected lines Version
Package MX6 = micro QFN-6L
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Package information
ECMF02-2AMX6
4
Package information

Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 3. Micro QFN-6L 1.7x1.5 dimensions
Dimensions
D
Ref.
E
Millimeters Min. Typ. 0.50 0.02 0.25 1.70 1.50 0.50 0.40 Max. Min.
Inches Typ. Max. 0.022
A
TOP VIEW
0.45 0.00 0.18 1.65 1.45 0.45 0.30
0.55 0.018 0.020 0.05
A
A1
A1 b
0.00 0.0008 0.0009 0.012 0.069 0.061 0.022 0.020
SIDE VIEW e
0.30 0.007 0.010 1.75 0.065 0.067 1.55 0.057 0.059 0.55 0.018 0.020 0.50 0.012 0.016
b
D E e L
L
Figure 20. Footprint (dimensions in mm) Figure 21. Marking
0.25
0.6
KD
1.9
1.25
Note:
Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
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ECMF02-2AMX6 Figure 22. Tape and reel specifications
Dot identifying Pin A1 location 2.0 0.22 4.0
Package information
O 1.55
1.85
8.0
KD
KD
KD
1.63 0.75
4.0
All dimensions are typical values in mm
User direction of unreeling
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1.75
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Recommendation on PCB assembly
ECMF02-2AMX6
5
5.1
Recommendation on PCB assembly
Stencil opening design
1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 23. Stencil opening dimensions
L
T
W
b)
General design rule Stencil thickness (T) = 75 ~ 125 m W Aspect ratio = ---- 1.5 T LxW Aspect area = --------------------------- 0.66 2T ( L + W )
2.
Reference design a) b) Stencil opening thickness: 100 m Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 24. Recommended stencil window position
15 m
570 m
7 m 236 m 250m
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Stencil window Footprint
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600 m
DataSheet.in
ECMF02-2AMX6
Recommendation on PCB assembly
5.2
Solder paste
1. 2. 3. 4. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste recommended. Offers a high tack force to resist component displacement during PCB movement. Use solder paste with fine particles: powder particle size 20-45 m.
5.3
Placement
1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
5. 6.
5.4
PCB design preference
1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
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Recommendation on PCB assembly
ECMF02-2AMX6
5.5
Reflow profile
Figure 25. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting
Temperature (C)
260C max 255C 220C 180C 125 C
2C/s recommended 2C/s recommended 6C/s max 6C/s max
3C/s max 3C/s max
0 0 1 2 3 4 5
10-30 sec 90 to 150 sec 90 sec max
6
7
Time (min)
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
5.6
Layout recommendation
Connection to PCB GND must be as short as possible to ensure ESD remaining voltage and SCC21 performance. Figure 26. Layout recommendation
Zdiff according to the application
Vias to GND plane
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ECMF02-2AMX6
Ordering information
6
Ordering information
Table 4. Ordering information
Marking KD(1) Package QFN-6L Weight 3.55 mg Base qty 3000 Delivery mode Tape and reel 7"
Order code ECMF02-2AMX6
1. The marking can be rotated by 90 to differentiate assembly location
For the latest information on available order codes see the product pages on www.st.com.
7
Revision history
Table 5.
Date 10-Aug-2010
Document revision history
Revision 1 Initial release. Changes
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ECMF02-2AMX6
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